Browse Prior Art Database

Cooling Plate with Conformal Thermal Contact Capability

IP.com Disclosure Number: IPCOM000116544D
Original Publication Date: 1995-Sep-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 1 page(s) / 62K

Publishing Venue

IBM

Related People

Anderson, TM: AUTHOR [+2]

Abstract

A method for cooling high powered card-mounted electronic modules in a high performance and cost-effective manner is disclosed. The concept seeks to apply the significant heat transfer performance and cooling capability of rigid cold plate/liquid coolant technology to the irregular and non-rigid surface topology of card-mounted electronic components.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 74% of the total text.

Cooling Plate with Conformal Thermal Contact Capability

      A method for cooling high powered card-mounted electronic
modules in a high performance and cost-effective manner is disclosed.
The concept seeks to apply the significant heat transfer performance
and cooling capability of rigid cold plate/liquid coolant technology
to the irregular and non-rigid surface topology of card-mounted
electronic components.

      A highly conductive (i.e., copper or aluminum) cold plate (101)
with embedded liquid coolant tubing (102) serves as one side of an
enclosure containing a fluid with good thermal and environmental
properties (103).  A conformal sheet (104) is bonded (105) to the
cold plate to form the balance of the fluid enclosure.  A key aspect
of the concept is the inclusion of an enhanced surface (106) on the
wet side of the cold plate to augment heat transfer from the fluid.

      The conformal surface and the fluid volume are designed to
accommodate the irregular surface topology of the card as well as
card flexure.  The conformal sheet flexes to contact the top surface
of each individual heat rejecting component (107) mounted on the card
(108).  Some structure is provided (not shown) to function as the
compressive force holding the card to the cooling plate.  This
function would be easily accomplished by enclosing sheetwork.

      The heat flow path through this cooling system is from the chip
metallurgy, through the chip backside, through the chip...