Browse Prior Art Database

Heatsink with Small Mountain Profile for Thermal Conductive Rubber

IP.com Disclosure Number: IPCOM000116606D
Original Publication Date: 1995-Oct-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Horiuchi, M: AUTHOR [+3]

Abstract

Disclosed is a thermal conductive system for high performance Notebook computers. This system consists of packaged electrical tip Central Processing Unit (CPU) etc., thermal conductive rubber and heatsink which has small mountain profile. This system can reduce air bubbles between a mountain on the heatsink and rubber sheets, and brings perfect physical contact and thermal conductive performance.

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Heatsink with Small Mountain Profile for Thermal Conductive Rubber

      Disclosed is a thermal conductive system for high performance
Notebook computers.  This system consists of packaged electrical tip
Central Processing Unit (CPU) etc., thermal conductive rubber and
heatsink which has small mountain profile.  This system can reduce
air bubbles between a mountain on the heatsink and rubber sheets, and
brings perfect physical contact and thermal conductive performance.

      Fig. 1 shows assembling process of this system.  At first, the
top of a mountain on the heatsink touches the rubber (Fig. 1-a).
Then, the heatsink goes into the rubber and contact area increase
from the top point to the outside of the rubber (Fig. 1-b).  Air is
continuously pushed out from the clearance so that air bubbles never
appear between the heatsink and the rubber (Fig. 1-c).

      This system also makes the distance, Electrical tip and the
heatsink shorter (Fig. 2).  This is a good effect for thermal
conductive.

      The disclosure shows a mountain profile on the heatsink, but of
course, instead of the heatsink, a package of electrical tip may have
a mountain like the heatsink.  This alternate system brings the same
performance as a mountain on the heatsink (Fig. 3).