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Enhanced Parallel Flow Cooling Device

IP.com Disclosure Number: IPCOM000116623D
Original Publication Date: 1995-Oct-01
Included in the Prior Art Database: 2005-Mar-31
Document File: 2 page(s) / 71K

Publishing Venue

IBM

Related People

Chrysler, GM: AUTHOR [+2]

Abstract

Due to the nature of jet impingement cooling, the heat transfer coefficient is a strong function of distance from the region of impingement. The rapid decrease in the heat transfer coefficient with distance forces higher air flow rates than would otherwise be needed if the heat transfer remained more uniform and at the higher value associated with the stagnation region. A method is described which allows for enhancement of the overall heat transfer by accelerating the coolant flow in the region away form the stagnation area.

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Enhanced Parallel Flow Cooling Device

      Due to the nature of jet impingement cooling, the heat transfer
coefficient is a strong function of distance from the region of
impingement.  The rapid decrease in the heat transfer coefficient
with distance forces higher air flow rates than would otherwise be
needed if the heat transfer remained more uniform and at the higher
value associated with the stagnation region.  A method is described
which allows for enhancement of the overall heat transfer by
accelerating
the coolant flow in the region away form the stagnation area.

      An Enhanced Parallel Cooling Device is presented in the Figure.
A single slot jet impinges in the central region (1).  After
impingement, the air moves through the fins (2) of the devices.  In
order to achieve the optimum heat transfer with the minimum air flow
rate, the channel formed by the fins are not uniform in
cross-section.  The cross section of the coolant channels narrows in
the flow direction forcing the coolant to accelerate, maintaining the
coolant velocity at a value which provides substantial heat transfer
enhancement over a more simple uniform cross section channel.

      This device can be manufactured in from two parts: 1) a solid
base (3), providing a reduced spreading resistance in the event that
a module is not uniformly powered, and 2) the parallel flow channels,
or fins.  The base can be made by normal milling operations to
provide the desired surface and flatn...