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Browse Prior Art Database

Leadless Chip Carrier Preform Pattern

IP.com Disclosure Number: IPCOM000116645D
Original Publication Date: 1995-Oct-01
Included in the Prior Art Database: 2005-Mar-31
Document File: 2 page(s) / 32K

Publishing Venue

IBM

Related People

Casciani, JJ: AUTHOR [+3]

Abstract

Disclosed is a preform pattern for use in the production and repair of (LCC) component circuit cards. An integrated preform pattern offers the user the precise solder volume found in using individual preforms while maintaining preform spacing and eliminating potential movement prior to the reflow process.

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Leadless Chip Carrier Preform Pattern

      Disclosed is a preform pattern for use in the production and
repair of (LCC) component circuit cards.  An integrated preform
pattern offers the user the precise solder volume found in using
individual preforms while maintaining preform spacing and eliminating
potential movement prior to the reflow process.

      In the Figure, a preform pattern fabricated for a 20 I/O LCC is
shown.  The preform pattern utilizes a thin web of solder between
each preform to maintain pattern accuracy and stability.  This web
wicks to the adjacent preforms during the reflow process and prevents
preforms from moving prior to the reflow process which can cause
solder balls, bridging, and insufficient or excessive solder joints.

Individual preform patterns are fabricated based on component I/O and
geometry.

      These preform patterns can also be expanded to the board or
circuit card level, where ALL component preforms are webbed together
in one sheet.