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Heat Spreading Mechanism for Reversed Component

IP.com Disclosure Number: IPCOM000116658D
Original Publication Date: 1995-Oct-01
Included in the Prior Art Database: 2005-Mar-31
Document File: 2 page(s) / 44K

Publishing Venue

IBM

Related People

Noguchi, H: AUTHOR [+2]

Abstract

Disclosed is a cooling system for electrical component of Notebook PC (Personal Computer) which is located on the bottom side of electrical board.

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Heat Spreading Mechanism for Reversed Component

      Disclosed is a cooling system for electrical component of
Notebook PC (Personal Computer) which is located on the bottom side
of electrical board.

      Fig. 1 shows the structure of the subject cooling system;
  (1) An aluminum Heatsink 1 wraps both top and bottom side of an
       electrical board.
  (2) An aluminum Heatsink 2 touches to an component mounted on the
       electrical board through the opening of the electrical board
       and by way of thermal grease.
  (3) A thermal rubber sheet is put between Heatsink 1 and the
       electrical board.

The heat created by the component is transferred to the heatsink as
shown in Fig.2;
  a) Heat from the other board is intercepted by Heatsink 1.
  b) Heatsink 1 absorbs the heat of the component at the bottom side.
  c) a) and b) can be  transported to the top side of Heatsink 1.
  d) Heat created at the bottom side of the component is transferred
to
      Heatsink 1 and 2.
  e) A part of the heat escapes from the component foot, but it
      is also absorbed by Heatsink 1 by way of Thermal rubber.

      Thus Heatsink 1 captures all the heat generated by the
component.  According to the results of our experiments, this system
can reduce the component temperature about 10 - 15 degrees C.