Browse Prior Art Database

Solder Joint Construction between Tape Carrier Package and Printed Circuit Board

IP.com Disclosure Number: IPCOM000116799D
Original Publication Date: 1995-Nov-01
Included in the Prior Art Database: 2005-Mar-31
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Ohkuma, H: AUTHOR

Abstract

Disclosed is a solder joint construction between Tape Carrier Package (TCP) and Printed Circuit Board (PCB) in order to avoid the occurrence of solder balls, where so-called "Anchor"joint is made in order to enhance the solder joint reliability of TCP leads especially for Liquid Crystal Display (LCD).

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Solder Joint Construction between Tape Carrier Package and Printed
Circuit Board

      Disclosed is a solder joint construction between Tape Carrier
Package (TCP) and Printed Circuit Board (PCB) in order to avoid the
occurrence of solder balls, where so-called "Anchor"joint is made in
order to enhance the solder joint reliability of TCP leads especially
for Liquid Crystal Display (LCD).

      Fig. 1 shows a typical anchor joint location between TCP
including driver Integrated Circuit (IC) and PCB being used for LCD
product.

      Fig. 2 shows the example of new solder joint construction in
order to trap the solder balls.  It shows that anchor pad area of TCP
is larger than that of PCB, and it works to trap the excessive melt
solder after the soldering heater block is pressed onto the
solder-coated anchor pad of PCB, and also shows that a surrounding
pad is located around the anchor pad of the PCB, and it works to trap
the excessive solder as well.  Fig. 3 illustrates how the excessive
melt solder is trapped to avoid solder balls during soldering process
of heater block contact method by this claim of the solder joint
construction.