Browse Prior Art Database

Module Stand-Off Concept

IP.com Disclosure Number: IPCOM000116809D
Original Publication Date: 1995-Nov-01
Included in the Prior Art Database: 2005-Mar-31
Document File: 2 page(s) / 22K

Publishing Venue

IBM

Related People

Heinzelman, AJ: AUTHOR [+2]

Abstract

Disclosed is a procedure that will eliminate additional parts for stand-offs, provide additional pins for more I/O, and allow corner pins to be used for correct orientation by omitting a pin or pins.

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Module Stand-Off Concept

      Disclosed is a procedure that will eliminate additional parts
for stand-offs, provide additional pins for more I/O, and allow
corner pins to be used for correct orientation by omitting a pin or
pins.

      Stand-offs (1) stamped in the chip cover (2) of a ceramic chip
(3) will provide precise clearance between printed circuit board (4)
and the module (Figure).  Other alternatives are formed or swaged
pins or plastic donut stand-offs on corner pins.

      Stand-offs stamped in metal cover or molded in plastic cover
are less expensive.  This type of stand-off allows corner pins to be
used for orientation during assembly or additional pins for more I/O.