Browse Prior Art Database

Keyboard Heat Sink for Notebook Personal Computer

IP.com Disclosure Number: IPCOM000116825D
Original Publication Date: 1995-Nov-01
Included in the Prior Art Database: 2005-Mar-31
Document File: 2 page(s) / 52K

Publishing Venue

IBM

Related People

Nakamura, F: AUTHOR

Abstract

Disclosed is a cooling mechanism designed especially for Notebook PC. The subject mechanism comprises heat plate that attaches to high temperature component, heat pipe, and heat sink. The typical example of the high temperature component is Micro Processing Unit (MPU), such as "DX4". The heat sink can serve as a keyboard back plate. This mechanism can convey a large amount of heat through keyboard rotative hinges. The cooling performance is extraordinarily high compared with conventional cooling mechanism.

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Keyboard Heat Sink for Notebook Personal Computer

      Disclosed is a cooling mechanism designed especially for
Notebook PC.  The subject mechanism comprises heat plate that
attaches to high temperature component, heat pipe, and heat sink.
The typical example of the high temperature component is Micro
Processing Unit (MPU), such as "DX4".  The heat sink can serve as a
keyboard back plate.  This mechanism can convey a large amount of
heat through keyboard rotative hinges.  The cooling performance is
extraordinarily high compared with conventional cooling mechanism.

      Many notebook PCs have an aluminum plate on the back of a
keyboard for the high strength to keep the keyboard key-in feeling.
There is a technical barrier for utilizing the plate as a heat sink
because many keyboards have rotative hinges to make them lids of the
system unit.

      As shown in Fig. 1, the heat plate has a hole into which the
heat pipe is inserted.  The diameter of the hole is almost the same
as that of the heat pipe.  This structure allows heat to be conveyed
through rotative hinges.  The heat pipe connects the heat plate with
the keyboard back plate.

      This technique is also applicable to other type of
electric/electronic devices.  For example, if there is keyboard
hinges at front, the heat pipe may be extended as shown in Fig. 2.
The another application is that Liquid Crystal Display (LCD) panel is
served also as the heat sink.  In this case, heat emitted fr...