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Shape of Lead Wire for Anodic Oxidation

IP.com Disclosure Number: IPCOM000116829D
Original Publication Date: 1995-Nov-01
Included in the Prior Art Database: 2005-Mar-31
Document File: 2 page(s) / 29K

Publishing Venue

IBM

Related People

Tobimatsu, K: AUTHOR

Abstract

Disclosed is a shape of lead line for anodic oxidation of metals or Si and other conductive materials. The shape defines anodic oxide film thickness, reduces the influence of pattern etching fluctuation and gets necessary distance quickly between isolated pattern and supply line by anodic oxidation.

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Shape of Lead Wire for Anodic Oxidation

      Disclosed is a shape of lead line for anodic oxidation of
metals or Si and other conductive materials.  The shape defines
anodic oxide film thickness, reduces the influence of pattern etching
fluctuation and gets necessary distance quickly between isolated
pattern and supply line by anodic oxidation.

      Fig. 1 shows the example of the lead wire shape (2).  As anodic
oxidation proceed, the conductive materials turn to oxide film from
the surface.  The narrowest width (1) defines the thickness of oxide
film on the isolated pattern (4) by being cut off from the
electricity
supply line (3).

      As oxidation proceeds further, lead wires (2) withdraw quickly
(Fig. 2) because of its slight tapered shape.  In case of delineating
patterns by photo process, etching process fluctuations influence the
width (1).  To reduce this influence, the lead wire shape has a sharp
angle (5) neck.