Browse Prior Art Database

Heat Sink Attachment and Rework Process for Capless Modules

IP.com Disclosure Number: IPCOM000116873D
Original Publication Date: 1995-Nov-01
Included in the Prior Art Database: 2005-Mar-31
Document File: 2 page(s) / 184K

Publishing Venue

IBM

Related People

Chance, EH: AUTHOR [+3]

Abstract

Disclosed is a process for attaching heatsinks to capless module chips which have smaller surface areas than the heatsinks. In this process, the combined use of thermally conductive adhesive tape and glue provide sufficient strength to hold the heatsink on the module chip and still allow removal and reuse of the module if necessary. The use of heat transfer adhesive tape alone may provide insufficient bonding strength and the use of glue alone, between the module chip and heatsink, may provide such a strong bond that the heatsink cannot be removed without damaging the module chip. The use of glue alone between chip and heatsink may also result in thermal and/or mechanical degradation of the glue bond over time.

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This is the abbreviated version, containing approximately 65% of the total text.

Heat Sink Attachment and Rework Process for Capless Modules

      Disclosed is a process for attaching heatsinks to capless
module chips which have smaller surface areas than the heatsinks.  In
this process, the combined use of thermally conductive adhesive tape
and glue provide sufficient strength to hold the heatsink on the
module chip and still allow removal and reuse of the module if
necessary.  The use of heat transfer adhesive tape alone may provide
insufficient bonding strength and the use of glue alone, between the
module chip and heatsink, may provide such a strong bond that the
heatsink cannot be removed without damaging the module chip.  The use
of glue alone between chip and heatsink may also result in thermal
and/or mechanical degradation of the glue bond over time.

      In this process, double backed thermally conductive adhesive
tape is cut to approximately the same surface area size as the module
chip.  This tape is attached to the heatsink or module chip.  This
tape transfers heat from the module chip to the heatsink in the final
assembly.

      Dots of glue are placed on the corners of the substrate portion
of the module assembly.  The mass of the glue dots is such that the
diameter of the glue dot is greater than the thickness of the module
chip.  These glue dots provide extra strength to the bonded heatsink
- module assembly.

      The heatsink is then attached to the module by hand or by a
mechanical placement tool with the ap...