Browse Prior Art Database

Improvement of Innerlaminate Adhesion for Plastics (Polyimide, Epoxide)

IP.com Disclosure Number: IPCOM000116938D
Original Publication Date: 1995-Nov-01
Included in the Prior Art Database: 2005-Mar-31
Document File: 2 page(s) / 49K

Publishing Venue

IBM

Related People

Lueck, P: AUTHOR [+3]

Abstract

Disclosed is a process, that improves the innerlaminate bond strength for polyimide by using a "press stud" technique. This technique is different from all known chemical or mechanical methods to improve the adhesion of dielectric materials used for PCB manufacturing.

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Improvement of Innerlaminate Adhesion for Plastics (Polyimide, Epoxide)

      Disclosed is a process, that improves the innerlaminate bond
strength for polyimide by using a "press stud" technique.  This
technique is different from all known chemical or mechanical methods
to improve the adhesion of dielectric materials used for PCB
manufacturing.

      For the DYCOSTRATE*  process, different plasma etchable
materials are used.  In general, polyimide is used and the polyimide
sheets are bonded together with a special bonding material.

      To avoid delamination if 2 or more sheet of polyimide (i.e.,
Espanex-foil) or other materials are bonded together, the following
method is used:

Process step
  1.  Through-holes are etched in Dielectric materials (plastic,
       polyimide, epoxide) with a plasma etch process.  The location
and
       the number of through-holes are defined by the design of the
PCB.

          With the here disclosed method, additional through-holes
    are added to nonfunctional areas; i.e., to areas where the PCB -
    design requires no lines/pads/vias or other electrical
    components.
  2.  Next step it the plate process, where the through-holes (Vias)
       are plated.  In the same step, without additional effort, the
       extra holes are plated.

          The copper in the Via connects the top sheet with the
    bottom sheet.  The result of the plated copper layer is a ...