Browse Prior Art Database

Process for Making Block-Out Structure for Write-Head

IP.com Disclosure Number: IPCOM000117014D
Original Publication Date: 1995-Dec-01
Included in the Prior Art Database: 2005-Mar-31
Document File: 2 page(s) / 35K

Publishing Venue

IBM

Related People

Hsiao, R: AUTHOR [+3]

Abstract

Disclosed is a method for preventing the short of P1/P2 and/or facilitating the metrology measurement of P2 trackwidth.

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This is the abbreviated version, containing approximately 94% of the total text.

Process for Making Block-Out Structure for Write-Head

      Disclosed is a method for preventing the short of P1/P2 and/or
facilitating the metrology measurement of P2 trackwidth.

      In the magnetic head building process, after the second
Pole-Piece (P2) is defined (by plating or ion milling), there are
several seedlayer cleaning and deposition processes.  These steps
would leave a metal layer on the sidewall of P1/gap/P2.  In the case
of inductive heads where the trackwidth of the first and second pole
piece are approximately the same, an apparent short is created.  For
the recording head where the read head is a magneto-resistive type
and the trackwidth of P1 and P2 are usually drastically different,
the side wall deposition would not cause the apparent P1/P2 short,
but will affect the metrology measurements for narrow P2.

      By using the following process, the problems described can be
avoided.  After the second pole-piece is defined, a layer of SiO2 is
deposited which covers the P1/gap/P2 stack.  Following the
deposition, a reactive-ion-etching process is done to remove the SiO2
from the horizontal surfaces so that connections can be made to the
magneto-resistive sensor and the coil by the subsequent lead and stud
process.  The anisotropic nature of the reactive non-ion-etching, the
etching of the second pole piece and the hardbaked resist insulation
is minimized during the overetch.  A vertical SiO2 sidewall on P1/P2
is thus produced and such...