Browse Prior Art Database

Compression Connector Backplate Serves as Efficient Heatsink

IP.com Disclosure Number: IPCOM000117024D
Original Publication Date: 1995-Dec-01
Included in the Prior Art Database: 2005-Mar-31
Document File: 2 page(s) / 44K

Publishing Venue

IBM

Related People

Karp, JM: AUTHOR [+2]

Abstract

The disclosed method uses the compression connector backplate as as heatsink for the circuits operating near the connector. Optimizing signal layout, ground layout, and backplate design significantly improve thermal performance.

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This is the abbreviated version, containing approximately 71% of the total text.

Compression Connector Backplate Serves as Efficient Heatsink

      The disclosed method uses the compression connector backplate
as as heatsink for the circuits operating near the connector.
Optimizing signal layout, ground layout, and backplate design
significantly improve thermal performance.

      In many cases, heat sinks or other thermal enhancements must be
used to remove the heat from the electronic devices.  The more heat
that can be removed, the more power may be dissipated in a given
module area and maintain the chip junction temperature.  The junction
temperature determines the long-term reliability of the device.

      This article discloses a method using the backplate of the
cable compression connector as the heat sink for the driver modules.
Because the driver modules interface over this cable, they are
required to be mounted on the card in close proximity to the
connector.  The method operates as follows:
  o  The heat is wicked out of the modules by the signal nets and the
      power/ground connection made to the device.
  o  The signal nets out of the module which feed the connector are
      made wide to effectively transfer out the heat.  The 4 are
wired
      on plane 1 (top plane of card) which is the surface where the
      connector backplate attaches.
  o  A copper ground plane is formed directly under the attachment
      surface of the backplate and internally connected to ground
plane
      o...