Browse Prior Art Database

Hybrid Flex Cable for Disk Drive Systems

IP.com Disclosure Number: IPCOM000117116D
Original Publication Date: 1995-Dec-01
Included in the Prior Art Database: 2005-Mar-31
Document File: 2 page(s) / 39K

Publishing Venue

IBM

Related People

Alavi, SM: AUTHOR [+3]

Abstract

Disclosed is an Arm Electronics (AE) packaging approach and apparatus for use in MR-Head/Disk recording systems wherein AE chips, resistors and capacitors are mounted onto a multi-layer circuit board (MLC) or FR4. A flex cable is attached to the backside of the "MLC" board to provide a hybrid flex cable.

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Hybrid Flex Cable for Disk Drive Systems

      Disclosed is an Arm Electronics (AE) packaging approach and
apparatus for use in MR-Head/Disk recording systems wherein AE chips,
resistors and capacitors are mounted onto a multi-layer circuit board
(MLC) or FR4.  A flex cable is attached to the backside of the "MLC"
board to provide a hybrid flex cable.

      As data storage systems have developed, each improvement
thereto has been directed to optimizing the compromise between data
rate, read/write signal amplification and cost of I/O from the
magnetic media to outside of the HDA with a good signal to noise
ratio.  Thin film inductive heads do not require AE chips as close to
the magnetic heads as do magnetoresistive (MR) heads for signal to
noise consideration.  Grounding schemes require close termination
distances for single ended AE chips for S/N ratio.  The proposed
invention offers a satisfactory compromise to these competing
concerns.

      Resistors and capacitors are attached via a surface mount
process, and the AE chips are mounted to the ground plane which
preferably has thermal vias built into the MLC.  The AE chips are
preferably wire bonded with gold wire, and covered with adhesive.
All components preferably reside on the top side of the MLC where
lead wire pads are provided for magnetic head connection on the
actuator.  The bottom side of the MLC has pads for flex cable
attachment.  A low cost single layer flex is attached, e.g., via a
hot b...