Browse Prior Art Database

Low Roughness Circumferential Polish for Magnetic Recording

IP.com Disclosure Number: IPCOM000117187D
Original Publication Date: 1996-Jan-01
Included in the Prior Art Database: 2005-Mar-31
Document File: 2 page(s) / 31K

Publishing Venue

IBM

Related People

Hagan, JA: AUTHOR [+3]

Abstract

A method for enhancing magnetic recording performance by imparting a very low roughness circumferential polish is disclosed. When applied over existing non-optimal polish patterns (random or radially orientated), a circumferential pattern has been shown to improve magnetic soft error rate and defect performance.

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Low Roughness Circumferential Polish for Magnetic Recording

      A method for enhancing magnetic recording performance by
imparting a very low roughness circumferential polish is disclosed.
When applied over existing non-optimal polish patterns (random or
radially orientated), a circumferential pattern has been shown to
improve magnetic soft error rate and defect performance.

      The circumferential polish pattern can be imparted onto a
standard polished substrate by using a wide variation of materials or
processing machines.  The basic intent to impart a relatively smooth
(1-10A Ra) pattern that has high scratch density.  This overlying
pattern provides an excellent surface for sputtering magnetic films
thereby enhancing bulk magnetic properties which ultimately improves
defect and soft error rate levels.

The process description is as follows:
  The circumferential pattern is produced by a round mandrel or
roller which is wrapped with a polymeric polish pad.  The mandrel is
oriented radially across the disk and rotates at relatively high
speeds while the disk rotates at a slower speed.  A free-abrasive
slurry is introduced to the interface to provide the polishing
component.