Browse Prior Art Database

Indium-Tin-Oxide Sputtering with 42NI-FE Alloy Mask

IP.com Disclosure Number: IPCOM000117240D
Original Publication Date: 1996-Jan-01
Included in the Prior Art Database: 2005-Mar-31
Document File: 2 page(s) / 32K

Publishing Venue

IBM

Related People

Kan, Y: AUTHOR

Abstract

Disclosed is a Indium-Tin-Oxide (ITO) thin film patterning method with using 42Ni-Fe alloy mask. ITO film is deposited on a substrate by sputtering during the process of manufacturing counterpart electrode of color filter product. This invention is proposed to improve ITO pattern accuracy by using mask having same thermal expansion ratio to that of the substrate.

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Indium-Tin-Oxide Sputtering with 42NI-FE Alloy Mask

      Disclosed is a Indium-Tin-Oxide (ITO) thin film patterning
method with using 42Ni-Fe alloy mask.  ITO film is deposited on a
substrate by sputtering  during the process of manufacturing
counterpart electrode of color filter product.  This invention is
proposed to improve ITO pattern accuracy by using mask having same
thermal expansion ratio to that of the substrate.

      As disclosed in the Figure, ITO is formed onto a portion of the
substrate which is not covered by metal mask which is deposited on
the substrate prior to the formation of ITO.  Then the mask is
removed to leave only ITO onto the substrate.  During the process of
forming ITO, which is actually made by sputtering, the surface
temperature of the substrate raises up to several hundred degrees,
causing shift of the pattern from that intended by the difference
(delta) or thermal expansion ratio of the mask and the substrate.

      42Ni-Fe alloy has same thermal expansion ratio as that of the
glass substrate used for Color Filter, thus effectively preventing
ITO pattern from shifting through sputtering, thereby improving
pattern accuracy.