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Browse Prior Art Database

Clear Plastic Lead-Frame Package for Surface Sensitive Optoelectronic Devices

IP.com Disclosure Number: IPCOM000117241D
Original Publication Date: 1996-Jan-01
Included in the Prior Art Database: 2005-Mar-31
Document File: 2 page(s) / 75K

Publishing Venue

IBM

Related People

Canora, FJ: AUTHOR [+2]

Abstract

One of the primary cost drivers of optoelectronic data communication technology is packaging. The principle packaging techniques used in "mid-volume" (as opposed to high-volume) optoelectronic packaging is the TO-can. This is an old-style package dating back 30 years to original electronic transistors and have been subsequently modified to accommodate optoelectronic devices. This invention describes a clear-plastic molded lead frame package which can provide similar electrical performance and superior mechanical function. The packaging technology is a straightforward modification/extension of the high-volume packaging used to package memory chips and other low-cost, high-volume semiconductor devices. The clear plastic molded leadframe may also be used for CD array chips commonly used in video cameras.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 53% of the total text.

Clear Plastic Lead-Frame Package for Surface Sensitive Optoelectronic
Devices

      One of the primary cost drivers of optoelectronic data
communication technology is packaging.  The principle packaging
techniques used in "mid-volume" (as opposed to high-volume)
optoelectronic packaging is the TO-can.  This is an old-style package
dating back 30 years to original electronic transistors and have been
subsequently modified to accommodate optoelectronic devices.  This
invention describes a clear-plastic molded lead frame package which
can provide similar electrical performance and superior mechanical
function.  The packaging technology is a straightforward
modification/extension of the high-volume packaging used to package
memory chips and other low-cost, high-volume semiconductor devices.
The clear plastic molded leadframe may also be used for CD array
chips commonly used in video cameras.  The volume of consumer
products utilizing CCD array chips is currently quite high and
continues to grow.  A low-cost high-quality clear plastic lead frame
package would be perfect for this application.

      The conventional low-cost, high-volume lead frame packaging
technology available in the semiconductor industry has been
modified/extended in the following ways:
  1.  clear molding compound: Hysol MG18 (rather than the
conventional
       opaque thermosetting resins that contain fillers and binders)
  2.  lead frame designed to accomodate/postion the
       photosensitive/photoemitting area of the optoelectronic device
in
       a precise location relative to the standard mechanical
alignment
...