Browse Prior Art Database

Alternate Circuit Board and Fabrication

IP.com Disclosure Number: IPCOM000117456D
Original Publication Date: 1996-Feb-01
Included in the Prior Art Database: 2005-Mar-31
Document File: 2 page(s) / 29K

Publishing Venue

IBM

Related People

Carpenter, RW: AUTHOR [+3]

Abstract

Traditionally, circuitry on a printed wiring board is achieved by additively plating copper in prefabricated channels using lithographic processes or by subtractively forming the patterns again using a lithographic process. The present art discloses a novel method of producing circuitry by forming first the pattern using a photosensitive dielectric and then additively plating in the channels and subsequently repairing the circuitry by the use of an electrically conductive adhesive.

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Alternate Circuit Board and Fabrication

      Traditionally, circuitry on a printed wiring board is
achieved by additively plating copper in prefabricated channels using
lithographic processes or by subtractively forming the patterns again
using a lithographic process.  The present art discloses a novel
method of producing circuitry by forming first the pattern using a
photosensitive dielectric and then additively plating in the channels
and subsequently repairing the circuitry by the use of an
electrically conductive adhesive.

A process describing the present art is as follows:
  A core about 30 mils thick is prepared using prepreg.  A
photosensitive dielectric is applied onto the core, exposed and
developed to form the appropriate pattern.  The dielectric is
subsequently cured for permanency.  Copper or a conductive medium is
additively plated into the predisposed pattern.  Repair of any
circuit line defects, preferably opens, is then achieved by placing
an electrically conductive adhesive.  The electrically conductive
adhesive is then cured at between 140-150C for about 1-2 hours to
sufficiently harden the material and produce an electrically
continuous medium.