Browse Prior Art Database

Anti-Crack Method for Semiconductor Package

IP.com Disclosure Number: IPCOM000117457D
Original Publication Date: 1996-Feb-01
Included in the Prior Art Database: 2005-Mar-31
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Kiyono, S: AUTHOR [+2]

Abstract

Disclosed is a method to prevent external cracks of semiconductor plastic packages, which has a construction of chip attached on diepad using adhesive epoxy.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Anti-Crack Method for Semiconductor Package

      Disclosed is a method to prevent external cracks of
semiconductor plastic packages, which has a construction of chip
attached on diepad using adhesive epoxy.

      Semiconductor plastic packages have a characteristic of body
bowing (bending) caused by the difference of thermal expansion of its
component as lead / chip / mold.  The generated internal stress
concentrates at the diepad edges, and causes plastic crack from this
point, then extends to the outside of package (Fig. 1).

      To avoid this problem, in the proposed scheme, (1) reduce the
diepad stiffness by reducing its thickness, (2) generate
protuberances as cylinder or cone shaped anchors to increase the
adhesion of diepad and mold compound (Figs. 2 and 3).

      This method is applicable for semiconductor plastic packages
which have potential concerns of plastic crack.