Browse Prior Art Database

Tape Carrier Package Outer Lead Bonding Method by Using Wire Bonding Technology

IP.com Disclosure Number: IPCOM000117482D
Original Publication Date: 1996-Mar-01
Included in the Prior Art Database: 2005-Mar-31
Document File: 2 page(s) / 40K

Publishing Venue

IBM

Related People

Sakurai, K: AUTHOR

Abstract

Disclosed is a joint method between Tape Carrier Package (TCP) and Card lead using Gold/Aluminum wire bonding technology.

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Tape Carrier Package Outer Lead Bonding Method by Using Wire Bonding
Technology

      Disclosed is a joint method between Tape Carrier Package (TCP)
and Card lead using Gold/Aluminum wire bonding technology.

      The example of this new process is explained by Figs. (a) to
(f).

      First, a Large Scale Integration (LSI) Chip is jointed on a TCP
Package, of which lead surface is plated by GOLD (Fig. (a)).

      Second, the inside part of TCP outer lead device hole is cut
off by a punch and attached on the card with an adhesive (Figs. (b)
and (c)).

      Third, Gold wire is jointed between the exposed gold plated
lead of TCP and the Gold plated lead of Card.

      Finally, a liquid epoxy resin is dropped around wire joint area
and hardened by heating in order to protect wire joint area (Fig.
(e)).

      Fig. (f) shows an example of TCP and Card lead surface finish.