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Browse Prior Art Database

Elastomeric Thermal Grease Seal

IP.com Disclosure Number: IPCOM000117512D
Original Publication Date: 1996-Mar-01
Included in the Prior Art Database: 2005-Mar-31
Document File: 4 page(s) / 88K

Publishing Venue

IBM

Related People

Brodsky, WL: AUTHOR [+4]

Abstract

Disclosed is a method and device to contain thermal grease between the top of a capped module and a heat sink in multi-module package applications where, due to the assembly tolerances, the grease thickness can vary from module to module. This seal supports the thermal grease layer and prevents it from flowing out of the module cap to heat sink space and onto the solder connections.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 52% of the total text.

Elastomeric Thermal Grease Seal

      Disclosed is a method and device to contain thermal grease
between the top of a capped module and a heat sink in multi-module
package applications where, due to the assembly tolerances, the
grease thickness can vary from module to module.  This seal supports
the thermal grease layer and prevents it from flowing out of the
module cap to heat sink space and onto the solder connections.

Some advantages are as follows:
  o  The seal works with modules mounted in a vertical or horizontal
      position.
  o  The flanged seal does not produce a load on the solder
      connections as would a conventional O-Ring seal between the
      module cap and heat sink.
  o  The top part of the seal allows for excess thermal grease to
      escape from the cap area after which the top edge of the seal
      will re-seal.
  o  The bottom edge of the seal keeps grease from migrating around
to
      the solder connections.
  o  The flange seal around the module prevents grease from flowing
      past the module side to the solder connections.
  o  The seal's compliancy allows for variations in height of the gap
      between the various modules and the underside of the heat sink.
  o  The seal allows for expansion and contraction during thermal
      cycling.

      To assemble the system, the modules are first assembled to
the card using SBC, C-4, or other solder methods.  Then the seal is
slipped over and around the module allowing the flange to position
itself along the four edges of the module.  Thermal grease is applied
to the top of the module.  These steps are repeated for the other
modules in the as...