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Resin Fill-in Hole Method by Removable Laminate Film

IP.com Disclosure Number: IPCOM000117578D
Original Publication Date: 1996-Apr-01
Included in the Prior Art Database: 2005-Mar-31
Document File: 2 page(s) / 29K

Publishing Venue

IBM

Related People

Katoh, T: AUTHOR [+3]

Abstract

Disclosed is a method to fill resin into holes of a board by the vacuum heat press of a resin-soaked sheet through a removable drilled film.

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This is the abbreviated version, containing approximately 100% of the total text.

Resin Fill-in Hole Method by Removable Laminate Film

      Disclosed is a method to fill resin into holes of a board by
the vacuum heat press of a resin-soaked sheet through a removable
drilled film.

      The Figure shows the process of this method.  (1) Set a board,
a resin soaked sheet and removable films as described.  (2) Press
them and melt resin into holes under vacuum environment.  (3) Tear
off a resin soaked sheet and removable films.  (4) Grind and flatten
the surface of the board and remove excessive resin.

      This method improves the quality of a resin-filled board, to be
boidless achieving high integration of Surface Laminated Circuit
(SLC).