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Browse Prior Art Database

Slow Input/Output Count Circuit Chip Connection

IP.com Disclosure Number: IPCOM000117580D
Original Publication Date: 1996-Apr-01
Included in the Prior Art Database: 2005-Mar-31
Document File: 2 page(s) / 24K

Publishing Venue

IBM

Related People

Brady, MJ: AUTHOR [+2]

Abstract

Disclosed is a novel structure and method for the connection of low Input/Output count circuit chips. This invention makes use of low-cost spot welding apparatus.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Slow Input/Output Count Circuit Chip Connection

Disclosed is a novel structure and method for the connection of low
Input/Output count circuit chips.  This invention makes use of
low-cost spot welding apparatus.

      The spot welder consists of a low-voltage high-current power
supply and a pair of electrodes.  The electrodes are positioned on
the surface of the metal contact to be bonded to the chip and are
used to press the lead to the chip surface.  An electric pulse is
then applied to fuse the metal to the chip bonding pad to produce a
robust mechanical and electrical spot-welded bond.

      The advantage of spot welding over conventional chip bonding
techniques is the spot welding may be used to bond many more
varieties of metal contacts than can the conventional techniques.
The method would be used preferably for low I/O circuit chips such as
LEDs.