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Heat Sink Attach Process for Surface Mounted Technology, Tape Automated Bonding and Card on Board Devices

IP.com Disclosure Number: IPCOM000117599D
Original Publication Date: 1996-Apr-01
Included in the Prior Art Database: 2005-Mar-31
Document File: 2 page(s) / 36K

Publishing Venue

IBM

Related People

Harper, BR: AUTHOR [+3]

Abstract

A method is disclosed for attaching heat sinks to an FR4 printed circuit board using a normal double sided Surface Mounted Technology (SMT) process.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Heat Sink Attach Process for Surface Mounted Technology, Tape Automated
Bonding and Card on Board Devices

      A method is disclosed for attaching heat sinks to an FR4
printed circuit board using a normal double sided Surface Mounted
Technology (SMT) process.

      Using a normal FR4 printed circuit board, punch a hole in it
where the chip/component is to be attached to a heat sink which is
mounted on the bottom side of the card.  The heat sink is an
inexpensive copper slug which is coined to fit up into the hole in
the printed circuit board.  This slug can be placed on the bottom
side of the card along with other bottom side SMT components and
soldered to the card for electrical and mechanical connection.
Topside SMT assembly would then proceed as normal with the
die/component being  placed in solder on top of the slug while other
topside SMT components  were placed.  The whole card would then be
reflowed to solder the topside  components to the card and the bottom
side components would hold on via  surface tension of the solder.