Browse Prior Art Database

Constant Heat-Soldering Method Using Metal Wire

IP.com Disclosure Number: IPCOM000117601D
Original Publication Date: 1996-Apr-01
Included in the Prior Art Database: 2005-Mar-31
Document File: 2 page(s) / 48K

Publishing Venue

IBM

Related People

Andoh, G: AUTHOR [+2]

Abstract

Disclosed is a method for soldering leads of a component to a substrate using the metal wire of small diameter. The feature of this method is to heat the leads which is mounted on the substrate, not directly, but via a piece of metal wire which is physically apart from the heating device.

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Constant Heat-Soldering Method Using Metal Wire

      Disclosed is a method for soldering leads of a component to a
substrate using the metal wire of small diameter.  The feature of
this method is to heat the leads which is mounted on the substrate,
not directly, but via a piece of metal wire which is physically apart
from the heating device.

      The details of this invention are disclosed by using Figs. 1
to 3.  Referring to Fig. 1, the objective of soldering, which is a
row of leads, is disclosed.  Also, the heating device is disclosed as
a heater block, of which lower surface is grooved, e.g.: 1mm in
diameter, to insert a metal wire.  The soldering is achieved by
transferring the  heat generated by the heater block to the row of
leads to be soldered,  via metal wire.

      Prior to soldering, the metal wire contacts the heat block in
the groove.  Flux material and solder are mounted on the leads at the
same time.  Then, the heat block moves down gradually to contact the
metal wire to the leads for soldering purpose (Fig. 2), and after
several seconds of maintaining the contact between the wire and the
leads, only the heat block is released from the leads (Fig. 3),
leaving the metal wire onto the leads.  This is because the heat
capacity of metal wire is much smaller than that of heat block with
metal wire, thereby achieving a fast cooling rate to increase the
productivity of the process.

      The advantage of this invention also lies in the...