Browse Prior Art Database

Self-Contained Active Heat Dissipation Device

IP.com Disclosure Number: IPCOM000117605D
Original Publication Date: 1996-Apr-01
Included in the Prior Art Database: 2005-Mar-31
Document File: 2 page(s) / 61K

Publishing Venue

IBM

Related People

Anderson, TM: AUTHOR [+3]

Abstract

Disclosed is a method of enhancing the heat transfer coefficient within and around the fins of a heat sink without relying on increased system pressure drop or increased Air Moving Device (AMD) flow output. The enhancement is accomplished by providing extra mixing of the cooling air as it passes through the heat sink through the application of one or more piezoelectric pumps.

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Self-Contained Active Heat Dissipation Device

      Disclosed is a method of enhancing the heat transfer
coefficient within and around the fins of a heat sink without relying
on increased system pressure drop or increased Air Moving Device
(AMD) flow output.  The enhancement is accomplished by providing
extra mixing of the cooling air as it passes through the heat sink
through the application of one or more piezoelectric pumps.

      A heat sink (101) for an enhanced electronics module (102) is
partially covered by a shroud (103) as shown in the Figure.  At the
top of the shroud is positioned a piezoelectric pump (104).  The
positioning of the pump is such that the air jet it creates impinges
on the central area of the heat sink.  This pulsating jet of air
disturbs the developing thermal and viscous boundary layers and
provides enhanced mixing of the cooling air as it passes through the
fins of the heat sink, thus effectively enhancing the convective heat
transfer coefficient.  The contour of cover shroud provides optimum
thermal enhancement by focusing thermal mixing onto the central area
of heat sink where it is needed most, or it can be customized to
focus the mixing onto other areas, if needed.

      Placement of the Self-Contained Active Heat Transfer Devices
within an enclosure is the same as with conventional heat sinks.  The
enclosure would still have a primary AMD to direct the cooling air
into the enclosure, and through the heat dissipating com...