Browse Prior Art Database

New Cooling Scheme for Electronic Equipment Installed in an Open, Unsheltered En

IP.com Disclosure Number: IPCOM000117635D
Original Publication Date: 1996-Apr-01
Included in the Prior Art Database: 2005-Mar-31
Document File: 4 page(s) / 96K

Publishing Venue

IBM

Related People

Agonafer, D: AUTHOR [+4]

Abstract

Disclosed is a method of packaging future electronics within an enclosure, along with the required thermal support apparatus to provide an easily manufactured and serviced watertight unit for use in areas not normally associated with computers - i.e., outdoors. In addition to the need for service accessibility, there will be taxing environmental requirements for any external unit. The external temperature may range from very low subfreezing in the northern latitudes to extremely high temperatures in desert climates.

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This is the abbreviated version, containing approximately 52% of the total text.

New Cooling Scheme for Electronic Equipment Installed in an Open,
Unsheltered En

      Disclosed is a method of packaging future electronics within an
enclosure, along with the required thermal support apparatus to
provide an easily manufactured and serviced watertight unit for use
in areas not  normally associated with computers - i.e., outdoors.
In addition to the  need for service accessibility, there will be
taxing environmental requirements for any external unit.  The
external temperature may range  from very low subfreezing in the
northern latitudes to extremely high temperatures in desert climates.

      In order to have the electronics (cards, power supplies, etc.)
accessible for service, which may include adding additional
components or replacing existing ones in the field, it is desirable
to have all of them clearly exposed upon opening the door of the
enclosure.  This requirement is complicated by the need for an air
moving device and shrouding within the enclosure.  The figures show
such an enclosure (101) attached to an exterior wall of a house wall
(102).  The back internal surface of the enclosure (103) supports one
or more backplanes  (104).  Feature cards (105) are attached to the
backplane.  In order to meet the requirement of serviceability, the
cooling hardware is mounted to the door (106).  A single
internal/external heat sink (107)  is a major part of, and is sealed
or molded into the door.  This one-piece heat sink allows thermal
transport from the internal air to the external air with minimal
thermal interference.

      At the upper reaches of the box, on the inside, is an internal
air moving device (108) (iAMD).  The iAMD directs the heated air
downward through the internal fins (109) of the heat s...