Browse Prior Art Database

Multi-Chip Module Impingment Cooling Plenum

IP.com Disclosure Number: IPCOM000117693D
Original Publication Date: 1996-May-01
Included in the Prior Art Database: 2005-Mar-31
Document File: 2 page(s) / 44K

Publishing Venue

IBM

Related People

Babcock, RF: AUTHOR [+5]

Abstract

Disclosed is a means of evenly ducting cooling impingement airflow from a dual impeller configuration to varied numbers of multiple, tightly spaced parallel processor modules arranged on a common backplane.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Multi-Chip Module Impingment Cooling Plenum

      Disclosed is a means of evenly ducting cooling impingement
airflow from a dual impeller configuration to varied numbers of
multiple, tightly spaced parallel processor modules arranged on a
common backplane.

      Elements of the invention are shown in the Figure, including
common plenum region (A), individual plenum ports (B), interior flow
splitter (C), exterior port region (D), alignment pin holes (E) and
pins (F), ramp (G), notch (H), end cap (J), end cap keying feature
(K).  Plenum installation is guided by two bullet-nosed alignment
pins screwed into the backplane stiffener.  The pins engage holes (E)
on the side flanges of the plenum near the ports.  The extra length
of the pins (F) facilitates alignment with the flange holes (E).  A
small ramp (G) raises the plenum end as it nears the bulkhead to
pre-align the final mounting screw holes.  The ramp rides in a notch
which also serves to key the part.

      A single plenum part may be used for any combination of modules
by applying end-caps (J) to the unused ports of the plenum.  The end
caps have a keying feature (K) which interferes with the heatsink
chimney (L) to prevent inadvertent assembly of a capped plenum port.