Browse Prior Art Database

Thermally Conductive Hinge for Notebook Computers

IP.com Disclosure Number: IPCOM000117754D
Original Publication Date: 1996-May-01
Included in the Prior Art Database: 2005-Mar-31
Document File: 4 page(s) / 124K

Publishing Venue

IBM

Related People

Buller, L: AUTHOR [+3]

Abstract

A method to use large panel areas of notebooks or other hinged door areas of electronic enclosures for cooling surfaces is disclosed. The technique increases the thermal capability of systems allowing greater function and higher speed components to be placed in enclosure geometries of decreased size.

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This is the abbreviated version, containing approximately 64% of the total text.

Thermally Conductive Hinge for Notebook Computers

      A method to use large panel areas of notebooks or other
hinged door areas of electronic enclosures for cooling surfaces is
disclosed.  The technique increases the thermal capability of systems
allowing greater function and higher speed components to be placed in
enclosure geometries of decreased size.

      Disclosed is a technique to transfer waste heat from high
powered electronic components to large heat exchange areas for
dissipation.  These areas could comprise system components such as
the viewing screen of a portable system, the door of a unit
enclosure, or other door or lid type structural members connected to
the system.

      A typical embodiment is depicted in Fig. 1.  A conducting plate
is shown in Fig. 1a which can either be (1) an extended portion of
the ground plane in the circuit card, or (2) a stamped or otherwise
shaped part that is to be bonded by some means to the circuit card or
the heat dissipating components.  A second plate is also stamped or
formed in some manner to conform to the size of the extended heat
dissipating area of the system unit (e.g., back panel of a display,
door of a system unit, etc.).  Both plates are formed with fingers as
shown in the figure, which are bent over a conductive hinge rod as
depicted in Fig. 1b.

      In this embodiment, heat is conducted from the electronics
bonded to the first plate through the extended fingers to the
conducting hinge r...