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Browse Prior Art Database

Backplane/Cage Assembly

IP.com Disclosure Number: IPCOM000117766D
Original Publication Date: 1996-May-01
Included in the Prior Art Database: 2005-Mar-31
Document File: 4 page(s) / 91K

Publishing Venue

IBM

Related People

Anderson, DR: AUTHOR [+8]

Abstract

Disclosed is a self-contained, cost-effective, reduced-size backplane assembly.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 74% of the total text.

Backplane/Cage Assembly

      Disclosed is a self-contained, cost-effective, reduced-size
backplane assembly.

      Elements of the design shown in Figs. 1, 2, and 3, include an
aluminum stiffener (2) which incorporates mounting of multi-chip
modules (MCMs), locating pins (3) to mount memory book cages.  A
bonding surface for the adhesive attachment of the backplane and
gussets (6) that support card cages is located on the stiffener.
Electromagnetic Compatibility (EMC) protection at the book level is
accomplished by book-to-book ground springs (not shown), providing a
daisy chain ground path to the cage.  An EMC enclosure is formed
around the books by the the cage weldment and perforated EMC shields
(4) which install over the guide rails (9).  The bottom of this
enclosure is formed by providing continuous contact around the
perimeter of the cage to the stiffener via an EMC gasket (10).  The
stiffener is in turn grounded to the frame by way of metal-to-metal
contact as well as mechanical fasteners (7).  The handles (8) are
included as part of this assembly to assist in installation, and
removal, into the frame.

      The EMC enclosure for the MCMs use the upper and lower cage
side plates (5) as well as the MCM duct seal (11).  The duct seal is
grounded to the cage and stiffener using fasteners and EMC gasket
respectively.  The duct seal prevents the recirculation of heated
processor exhaust air into the MCM blowers.  A third EMC enclosure
also exists fo...