Browse Prior Art Database

Heat Insulating by Fan Airflow

IP.com Disclosure Number: IPCOM000117957D
Original Publication Date: 1996-Jul-01
Included in the Prior Art Database: 2005-Mar-31
Document File: 2 page(s) / 39K

Publishing Venue

IBM

Related People

Honma, T: AUTHOR [+3]

Abstract

Disclosed is a heat insulating mechanism using a fan airflow.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Heat Insulating by Fan Airflow

      Disclosed is a heat insulating mechanism using a fan airflow.

      Heat transfer from the Microprocessor and Power Supply Unit
should be minimized to keep drives and battery cool.  They are laid
out in two areas, and fan airflow between them is used as the
insulating of heat convection, radiation and conduction through
covers.

      Heat consumption balances the temperature of the outer cover,
so heat insulating is required to make the Personal Computer (PC) box
small and to increase total heat consumption.  For example, the
inside temperature should be about 50 degrees C for the thermal
specification of drive units.  Micro Processing Unit / Power Supply
Unit (MPU/PSU) parts are functional at ambient temperature 75 degrees
C.  Then, this design utilizing heat insulating, allows larger power
consumption while keeping drive temperature low enough.  The chart
shows temperatures of each part.  The Figure shows an example of a
layout, where a duct of fan airflow is between the PSU/MPU and the
drives.  Outer covers are cooled by airflow, so that it reduces heat
convection and radiation from high temperature parts also.