Browse Prior Art Database

Forced Boiling Cooling System with Jet Enhancement for Critical Heat Flux Extension

IP.com Disclosure Number: IPCOM000118174D
Original Publication Date: 1996-Oct-01
Included in the Prior Art Database: 2005-Apr-01
Document File: 2 page(s) / 51K

Publishing Venue

IBM

Related People

Anderson, TM: AUTHOR [+3]

Abstract

Disclosed is a method for providing enhanced heat transfer from electronic chips in a low flowrate cooling package. High turbulence is provided at the chip surface in a low flowrate package.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 68% of the total text.

Forced Boiling Cooling System with Jet Enhancement for Critical Heat
Flux Extension

      Disclosed is a method for providing enhanced heat transfer from
electronic chips in a low flowrate cooling package.  High turbulence
is provided at the chip surface in a low flowrate package.

      This invention provides a means of operating a liquid-cooled
package utilizing a simple flow-boiling while still providing the
necessary heat transfer enhancement to cool the high flux chips.  The
disclosed technique optimally balances the requirement of high
coolant turbulence at the chip surface against the conflicting
requirements for  low cost and complexity.

      The method is depicted in the Figure.  The high turbulence
intensity required at the chip surface (101) to provide a high
convective heat transfer coefficient is provided by a secondary flow
(102) source  rather than the primary advective flow (103).  A
moderately-sized pump  (104) provides the necessary coolant
circulation to maintain the majority  of the chips within their
temperature band.  The coolant heats up and possibly boils as it
passes (with a washing flow) over the chips in the  package.  A
water-cooled (or air-cooled) condenser (105) provides the ultimate
sink for the heat dissipated in the system.  This system uses a
relatively low pressure pump and relatively low flow rates to provide
thermal advection role of the primary (washing) flow.  The high heat
flux chips are accommodated by the...