Dismiss
InnovationQ will be updated on Sunday, Oct. 22, from 10am ET - noon. You may experience brief service interruptions during that time.
Browse Prior Art Database

Chiplet Head Structure Formed with Released, Conventional Magneto Resistive or Inductive Heads

IP.com Disclosure Number: IPCOM000118198D
Original Publication Date: 1996-Oct-01
Included in the Prior Art Database: 2005-Apr-01
Document File: 3 page(s) / 77K

Publishing Venue

IBM

Related People

Fontana Jr, RE: AUTHOR [+5]

Abstract

A chiplet head structure is a thin film head with the substrate removed. The chiplet contains the yokes and coils embedded in the alumina undercoat and overcoat. Only horizontal heads, i.e., heads with the air bearing surface fabricated parallel to the substrate planes and with the gap fabricated perpendicular to the substrate planes, have been used in the chiplet configuration (Fig. 1). The horizontal head geometry does not allow for the fabrication of traditional Magneto Resistive (MR) heads since it is not possible to configure the thin MR layers into the required perpendicular gap geometry. This work describes a chiplet head structure which is compatible with conventional MR and inductive heads.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 63% of the total text.

Chiplet Head Structure Formed with Released, Conventional Magneto
Resistive or Inductive Heads

      A chiplet head structure is a thin film head with the substrate
removed.  The chiplet contains the yokes and coils embedded in the
alumina undercoat and overcoat.  Only horizontal heads, i.e., heads
with the air bearing surface fabricated parallel to the substrate
planes and with the gap fabricated perpendicular to the substrate
planes, have been used in the chiplet configuration (Fig. 1).  The
horizontal head geometry does not allow for the fabrication of
traditional Magneto Resistive (MR) heads since it is not possible to
configure the thin MR layers into the required perpendicular gap
geometry.  This work describes a chiplet head structure which is
compatible with  conventional MR and inductive heads.

      Specifically, a chiplet head structure with conventional
geometry yokes (MR or inductive) is formed by fabricating the head
yokes in the normal manner with the exception of initially depositing
a release layer material, copper for example, on the substrate.  When
the head structure is completed, trenches are etched through the
undercoat and overcoat and down to release layer to create columns on
the wafer layer.  This is followed by the normal row slicing of the
wafer and then the normal lapping of the row to form the appropriate
throat height and MR stripe height.  After the lapping, the critical
pole tip region is protected with resist and the releas...