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Browse Prior Art Database

Micro-Corrugated Structure and Method of Making Same

IP.com Disclosure Number: IPCOM000118246D
Original Publication Date: 1996-Nov-01
Included in the Prior Art Database: 2005-Apr-01
Document File: 2 page(s) / 51K

Publishing Venue

IBM

Related People

Palagonia, AM: AUTHOR

Abstract

Disclosed is a method of producing micro-corrugated structures by etching V grooves along the <111> plane of a <100> silicon substrate and using said V grooves as a mandrel.

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Micro-Corrugated Structure and Method of Making Same

      Disclosed is a method of producing micro-corrugated structures
by etching V grooves along the <111> plane of a <100> silicon
substrate and using said V grooves as a mandrel.

      Figs. 1A and 1B show two possible variations of the fully
corrugated structures that can be fabricated with this method.  These
structures include micro-springs, micro-shock absorbers, micro-heat
sinks, micro-insulators, micro gratings and micro lenses.  Structures
that are flat on one surface and corrugated on a second are also
possible.

      The method requires four major steps.  Producing the silicon
mandrel, depositing a release material, depositing the material of
the finished material, and dissolving the release layer.

      Figs. 2A-I show the generic processes steps of the method.
Note that the skipping step 2C produces the structure of Fig. 1B,
while doing step 2C produces the structure of Fig. 1A.

      The most critical processes steps are 2B/C.  The width and
pitch of the oxide mask and the length of time of etch will control
the final geometry of the silicon mandrel.  The actual silicon etch
is a strong aqueous base such as alkoholic KOH or aqueous
Tetramethylammonium Hydroxid (TMAH).

      Suitable combinations of release materials/final materials
include: Al, W, Cu, Ni, Au, etc/SiO2; SiN, Poly Si/SiO2; SiO2/SiN;
Organic/ SiO2.  Many others are possible.  It is only critical that
the etcha...