Browse Prior Art Database

Method for Cooling a Stack of Laminated Chips

IP.com Disclosure Number: IPCOM000118250D
Original Publication Date: 1996-Nov-01
Included in the Prior Art Database: 2005-Apr-01
Document File: 2 page(s) / 56K

Publishing Venue

IBM

Related People

Palagonia, AM: AUTHOR

Abstract

Disclosed is a method for providing heat dissipation of a stack of laminated chips by interspersing specialized cooling structures at periodic points within the monolithic structure of the chip stack. Three methods are disclosed.

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This is the abbreviated version, containing approximately 92% of the total text.

Method for Cooling a Stack of Laminated Chips

      Disclosed is a method for providing heat dissipation of a stack
of laminated chips by interspersing specialized cooling structures at
periodic points within the monolithic structure of the chip stack.
Three methods are disclosed.

      In a first embodiment, a special pair of chips is
interspersed.  One chip has had a trench etched into it, and the
other acts as a cap.  When put together and interspersed between
active chips,  they form cooling channels as shown in Fig. 1.  The C4
bumps provide electrical connection to the individual chips on one
face of the structure, while the cooling channels are exposed on a
second face. A  fluid manifold (not shown) is attached to this face
to provide coolant  flow.  The trenches may be etched in the cooling.
More than one face may be used for electrical connection to the chip
stack.

      In a second embodiment, metal cooling plates of Aluminum,
Copper, Molybdenum, etc. are interspersed between active chips, as
shown in Fig. 2.  The C4 bumps provide electrical connection to the
individual chips on one side of the face of the structure, while the
cooling plates are connected to a heat sink on a second face.  More
than one face may contain electrical connection to the chip stack.

      In a third embodiment (not shown), solid state cooling devices
are interspersed between active chips.  These are basically
thermocouple devices run backwards.  They are powe...