Browse Prior Art Database

Hierarchical Object Oriented Packaging Design Data Base

IP.com Disclosure Number: IPCOM000118283D
Original Publication Date: 1996-Dec-01
Included in the Prior Art Database: 2005-Apr-01
Document File: 4 page(s) / 174K

Publishing Venue

IBM

Related People

Basile, JE: AUTHOR [+7]

Abstract

Disclosed is a fully hierarchical and object oriented data base, supporting all packaging levels from chip sub-portion to cable. It allows for one centralized design data base and system support the full design cycle system packaging design. Use of private data control, locally defined field and field sizes and inheritance allow for totally encapsulated data, thus eliminating impact to user applications when/if any fields need to change in size, or when any new fields need to be added.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 28% of the total text.

Hierarchical Object Oriented Packaging Design Data Base

      Disclosed is a fully hierarchical and object oriented data
base, supporting all packaging levels from chip sub-portion to cable.
It allows for one centralized design data base and system support the
full design cycle system packaging design.  Use of private data
control, locally defined field and field sizes and inheritance allow
for totally encapsulated data, thus eliminating impact to user
applications when/if any fields need to change in size, or when any
new fields need to be added.

      As packaging complexity and density increases, problems
previously associated with package hierarchy have now moved into the
chip world.  Certain large Complementary Metal Oxide Semiconductor
(CMOS) chips have been designed with seven levels of hierarchy on the
chip alone.  The type of hierarchical support that was previously
required only on packages above the chip is now required on chips.
The complexity of previous data bases and the impact on applications
due to necessary changes in these data bases needed to be minimized.

      In order to eliminate the problems and limitations noted above,
a new data base was designed as is described herein.  Other data
bases support some of the concepts included here, but no existing
data base fully supports the complete set of packing requirements.
The highlights of this new full function data base are as follows:
  1.  Supports chip macros, sub-macros, sub-sub-macros, to any
       level of packaging through the use of generalized hierarchy.
  2.  Support all levels of traditional package hierarchy
       including cable.
  3.  This data base is object oriented.  The actual design data
       is private.  This prevents applications from updating it
       directly.  The lengths of all character fields are
       defined.  These constant values are to be used throughout
       the applications rather then hard coding field
       lengths.  These features will insure that the applications
       written against this data base will never be impacted by
       data base internal changes.  No application code will
       need to be rewritten to support changes in field lengths
       or positions.  This provides for easy modification.
  4.  Supports any number of levels of package hierarchy.
  5.  By supporting full system hierarchy, it will now be possible
       to trace though higher level package nets from source to
       sink, such as choosing a bundle of cable nets and analyzing
       them from driver chip circuit through the cards and/or
       Thermal Conduction Modules (TCMs), board and cables to the
       corresponding chip receiver circuits.
  6.  An object oriented linked list class has been provided
       to support generic traversal of all linked lists.

      An abridged summary of the design dat...