Browse Prior Art Database

Chip on Glass Interposer Carrier Structure

IP.com Disclosure Number: IPCOM000118428D
Original Publication Date: 1997-Feb-01
Included in the Prior Art Database: 2005-Apr-01
Document File: 2 page(s) / 36K

Publishing Venue

IBM

Related People

Nishida, H: AUTHOR [+2]

Abstract

Disclosed is a Chip On Glass (COG) Interposer Structure which provides electrical and mechanical connections between the terminals on Liquid Crystal Display (LCD) Glass Panel, Interposer Carrier (IC) Drivers, and Printed Circuit Board. Interposer Carrier and Driver IC are stacked and mounted with electrically Anisotropic Conductive Material on the LCD Glass.

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Chip on Glass Interposer Carrier Structure

      Disclosed is a Chip On Glass (COG) Interposer Structure which
provides electrical and mechanical connections between the terminals
on Liquid Crystal Display (LCD) Glass Panel, Interposer Carrier (IC)
Drivers, and Printed Circuit Board.  Interposer Carrier and Driver IC
are stacked and mounted with electrically Anisotropic Conductive
Material on the LCD Glass.

      The Figure shows the conceptual construction of the Interposer
Carrier Application.  Interposer Carrier (1) has the same patterns as
the terminals on Glass Panel (2) on the one-sided (side-A) and the
same patterns as the terminals of Driver-IC (3) on the other side
(side-B).  Terminals of side-A of the Interposer Carrier are aligned
to the terminals of the Glass-Panel and connected with Anisotropic
Conductive Material (4).  These terminals on the side-A are
electrically patterned to the Out-put Terminals (5) on the side-B.
Driver-IC is aligned to the Out-put Terminals and In-put Terminals
(6) on the side-B  and connected with AC-Material.  Bonding area of
the Interposer Carrier  and Driver-IC are stacked on to the terminals
on the Glass Panel so that  the the mounting area of the Glass Panel
can be minimized.