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Pad Pattern for Hot Bar Soldering

IP.com Disclosure Number: IPCOM000118433D
Original Publication Date: 1997-Feb-01
Included in the Prior Art Database: 2005-Apr-01
Document File: 2 page(s) / 33K

Publishing Venue

IBM

Related People

Fukuoka, K: AUTHOR [+3]

Abstract

Fig. 1 shows the conventional pad pattern of a Printed Circuit Board (PCB) in the case of a 0.4mm pitch, as an example. For a fine pitch pad pattern, conventional pad design causes some manufacturing difficulty at solder resist printing and solder paste printing.

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Pad Pattern for Hot Bar Soldering

      Fig. 1 shows the conventional pad pattern of a Printed Circuit
Board (PCB) in the case of a 0.4mm pitch, as an example.  For a fine
pitch pad pattern, conventional pad design causes some manufacturing
difficulty at solder resist printing and solder paste printing.

      There is not much clearance between pads, and this easily
induces solder bridges.  Also, the visual inspection for solder
fillet becomes much more difficult because the pad-width of the PCB
becomes almost the same as the lead-width of a Surface Mount Device
(SMD) such as a Tape Carrier Package (TCP).

      Fig. 2 shows the newly invented pad pattern of the PCB having
much clearance between pads for hot bar soldering.  Hot bar soldering
is to contact the center area of each pad where solder volume is
small compared with outside pads, in order to prevent solder bridges.
This pad design also makes the inspection for solder joints easier
because it is wider outside of each pad.