Browse Prior Art Database

Method for Evaluation of Underfill Encapsulant

IP.com Disclosure Number: IPCOM000118647D
Original Publication Date: 1997-Apr-01
Included in the Prior Art Database: 2005-Apr-01
Document File: 2 page(s) / 30K

Publishing Venue

IBM

Related People

Haigh, JL: AUTHOR [+2]

Abstract

Disclosed is a method for applying solder mask on glass or tempered glass, which provides a translucent surface for underfill encapsulation. The solder mask coated glass will allow an experimenter to observe the flow of an underfill encapsulant due to translucent surface of the glass.

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Method for Evaluation of Underfill Encapsulant

      Disclosed is a method for applying solder mask on glass or
tempered glass, which provides a translucent surface for underfill
encapsulation.  The solder mask coated glass will allow an
experimenter to observe the flow of an underfill encapsulant due to
translucent surface of the glass.

      As shown in the Figure, a thin layer of solder mask (1) (i.e.,
PSR4000) can be screened onto a glass or tempered glass (2) surface
with a thickness of one or two mils.  The glass then can be processed
normally, i.e., exposed, developed to provide a solder mask texture
and configuration like the real laminate product, except that it will
be transparent.

      A die (3) can be placed on the solder mask coated glass and
underfill encapsulant (4) can be dispensed normally.  The flow front
(5) of the encapsulant can be observed, which is obscured in the
actual product.  By observing (6) the flow front, an experimenter can
modify dispense patterns to improve their process development time.