Browse Prior Art Database

Ultra-Fine Pitch High Performance Tape Ball Grid Array

IP.com Disclosure Number: IPCOM000118663D
Original Publication Date: 1997-May-01
Included in the Prior Art Database: 2005-Apr-01
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Bhatt, AC: AUTHOR [+5]

Abstract

Ultra-fine pitch Tape Ball Grid Array (TBGA) fabricated with Kapton E* as a dielectric material, using unique process conditions, offers superior attributes compared to Kapton H*. Kapton H* Kapton E* 1. Chrome Copper adhesion 75-111 119-160 (gms/mm) 2. Shrinkage (PPM), 80-240 0-10 (upon cooling from 100C) 3. % Plated thru Hole (PTH) 20 1.5 fall out (12" WEB)

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Ultra-Fine Pitch High Performance Tape Ball Grid Array

      Ultra-fine pitch Tape Ball Grid Array (TBGA) fabricated with
Kapton E* as a dielectric material, using unique process conditions,
offers superior attributes compared to Kapton H*.
                              Kapton H*             Kapton E*
  1.  Chrome Copper adhesion     75-111               119-160
       (gms/mm)
  2.  Shrinkage (PPM),           80-240                 0-10
       (upon cooling from 100C)
  3.  % Plated thru Hole (PTH)   20                     1.5
       fall out  (12" WEB)

      A thin, light, high performance TBGA package's carrier
construction beings with a 12' side web of Kapton E in a
continuous-roll manufacturing line.  First plated through-hole vias
connections from signal to ground side of the tape for power
distribution are done.

      The  polyimide tape is preconditioned with oxalic acid at about
70-80 degrees F.  Then 1.0 mil CFIOC** resist with Mylar-D is
laminated on the tape at about 108 degrees C at 1.6 FPM (feet per
minute) via hot  roll lamination process.  Fine pitch images are
formed with conventional  expose and develop processes.

      The dielectric is metallized to desired thickness using
conventional electrolytic pattern copper plating.   Then resist and
unwanted seed layer are removed.

      Selective Kapto...