Browse Prior Art Database

Reusable Second Side Solder Paste Stencil Feature

IP.com Disclosure Number: IPCOM000118855D
Original Publication Date: 1997-Aug-01
Included in the Prior Art Database: 2005-Apr-01
Document File: 2 page(s) / 29K

Publishing Venue

IBM

Related People

Gaynes, MA: AUTHOR [+2]

Abstract

Disclosed is a tool to simplify the processing of solder screening a circuit card on the second pass side.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Reusable Second Side Solder Paste Stencil Feature

      Disclosed is a tool to simplify the processing of solder
screening a circuit card on the second pass side.

      Fig. 1 shows a circuit card (1) with components (2) that have
been processed on one side.  A certain volume of highly conformable
and moldable material such as clay or conformable gasket material (3)
is placed in a tray (5) and then covered with an Electro-Static
Discharge (ESD) sheet (4).  The card is placed in a simple press
shown on Fig. 2.  The moldable, clay-like material forms around all
the components, and the upper press plate (6) assures that the top
surface of the card is flat.  After the card and tray is removed from
the press,  it can be placed in the screener.  The card would be
removed from the tray after the solder paste was screened on the back
side.  The tray can  be used repeatedly by other assembled cards.