Browse Prior Art Database

Chip Column Package Structure

IP.com Disclosure Number: IPCOM000118869D
Original Publication Date: 1997-Aug-01
Included in the Prior Art Database: 2005-Apr-01
Document File: 2 page(s) / 31K

Publishing Venue

IBM

Related People

Pierson, MV: AUTHOR

Abstract

Disclosed is a structure and method for attaching a flip chip to a card with flexible connections.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Chip Column Package Structure

      Disclosed is a structure and method for attaching a flip chip
to a card with flexible connections.

      The Figure shows a section of a chip (1) that has been ball
bonded (2) with a conductive wire (3) that has either a spiral twist
or a "s" shape (4).  The shape in the wire will allow a slight z axis
distortion when the card is twisted or bent and will keep the chip
"floating" on the columns in all three axes.  The entire bottom of
the chip and wires are coated (5) with a high temperature insulator

(such as polyimide or low durometer silicon).  The tips of the wires
(6) have no insulator present.  Solder (7) connects the wire to the
circuit pad (8).

      If a heatsink (9) is to be added, it must be placed on the chip
before the wire bonds are added.

      For high vibration (such as military aircraft), a thin shround
(10) would be bonded (11) to the panel, then low durometer (5-10)
adhesive (12) would be dispensed at the center of the chip on all
four sides.