Browse Prior Art Database

Personal Computer Memory Card International Association Slot Heatsink for Thermal Reduction

IP.com Disclosure Number: IPCOM000118941D
Original Publication Date: 1997-Sep-01
Included in the Prior Art Database: 2005-Apr-01
Document File: 4 page(s) / 51K

Publishing Venue

IBM

Related People

Horikoshi, H: AUTHOR [+4]

Abstract

Disclosed is an apparatus of the type which has a Personal Computer Memory Card International Association (PCMCIA) card slot, such as a notebook Personal Computer (PC). In accordance with the subject invention, the temperature around the PCMCIA card slot can be reduced, by providing a heatsink, even when a PC card is inserted and operated. The function of the PCMCIA slot heatsink is not only cooling the slot, but also transferring the heat to the other lower-temperature material, like a shield plate, in order to reduce the temperature of the PCMCIA slot effectively.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Personal Computer Memory Card International Association Slot Heatsink
for Thermal Reduction

      Disclosed is an apparatus of the type which has a Personal
Computer Memory Card International Association (PCMCIA) card slot,
such as a notebook Personal Computer (PC).  In accordance with the
subject invention, the temperature around the PCMCIA card slot can be
reduced, by providing a heatsink, even when a PC card is inserted and
operated.  The function of the PCMCIA slot heatsink is not only
cooling the slot, but also transferring the heat to the other
lower-temperature material, like a shield plate, in order to reduce
the temperature of the PCMCIA slot effectively.

      Fig. 1 shows the assembling of the PCMCIA heatsink, (1) and
(3), that embodies the subject invention.

      Fig. 2 shows the PCMCIA heatsink side view.  By virtue of the
cooperative operation of (1) and (3), the heat is transferred to the
other material, such as a top shield case (5) in this figure.

      Fig. 3 shows the PCMCIA heatsink front view.  By virtue of the
cooperative operation of (1) and (3),  the heat is transferred to the
other material, such as a shield case (5) in this figure.  The
cooling fan (8) helps to release the heat from the top shield case
(5) to the outside.