Browse Prior Art Database

Cooling System

IP.com Disclosure Number: IPCOM000118979D
Original Publication Date: 1997-Oct-01
Included in the Prior Art Database: 2005-Apr-01
Document File: 2 page(s) / 33K

Publishing Venue

IBM

Related People

Ikegami, T: AUTHOR [+3]

Abstract

Disclosed is a cooling system for a notebook Personal Computer (PC) and a laptop PC. This system is constructed with a heat sink in a display unit and a heat transfer system from the base unit to a display unit by using a flexible and high heat conductivity sheet.

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This is the abbreviated version, containing approximately 100% of the total text.

Cooling System

      Disclosed is a cooling system for a notebook Personal Computer
(PC) and a laptop PC.  This system is constructed with a heat sink in
a display unit and a heat transfer system from the base unit to a
display unit by using a flexible and high heat conductivity sheet.

      The Figure shows an example of this system.  The heat from a
Central Processing Unit (CPU) or other high heat output component is
transferred to the connection area of a display unit and the base
unit through a heat pipe or high heat conductive material.  The
transferred heat flows furthermore to the heat sink in the display
unit through the flexible and high heat conductive sheet.  This
flexible and high heat conductive sheet absorb the friction that
accompanies the display  open-close movement.