Dismiss
InnovationQ will be updated on Sunday, Oct. 22, from 10am ET - noon. You may experience brief service interruptions during that time.
Browse Prior Art Database

Method of Adhesion of Resin to Copper Oxide Surfaces

IP.com Disclosure Number: IPCOM000118997D
Original Publication Date: 1997-Oct-01
Included in the Prior Art Database: 2005-Apr-01
Document File: 2 page(s) / 32K

Publishing Venue

IBM

Related People

Blumberg, LR: AUTHOR [+4]

Abstract

Disclosed is a laminated printed circuit board structure constructed from epoxy resin/fiberglass cloth prepreg and containing copper power and ground planes which have been treated with a two step process to enhance the adhesion to the epoxy/glass prepreg. The first step is exposure to a standard oxide or reduced oxide-type bath, which generates a copper oxide structure on the metallic copper surfaces. The second step is to treat this surface with a dilute solution of a resin in a suitable solvent. The solvent is then driven off by heat, while the remaining resin is baked to achieve a B-stage cure. The resin may be the same as that which will later be applied in the prepreg form or it may be an entirely different resin chemistry.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 99% of the total text.

Method of Adhesion of Resin to Copper Oxide Surfaces

      Disclosed is a laminated printed circuit board structure
constructed from epoxy resin/fiberglass cloth prepreg and containing
copper power and ground planes which have been treated with a two
step process to enhance the adhesion to the epoxy/glass prepreg.  The
first step is exposure to a standard oxide or reduced oxide-type
bath, which generates a copper oxide structure on the metallic copper
surfaces.  The second step is to treat this surface with a dilute
solution of a resin in a suitable solvent.  The solvent is then
driven off by heat, while the remaining resin is baked to achieve a
B-stage cure.  The resin may be the same as that which will later be
applied in the prepreg form or it may be an entirely different resin
chemistry.  By precoating the copper oxide structure in this way,
adhesion of the final resin/prepreg layer is enhanced, depending on
resin type, by as much as a factor of two.

      The adhesion improvement is realized by two mechanisms.  First,
the very low viscosity of the dilute resin solution (approximately 10
percent solids) more thoroughly wets out the intricate structure of
copper oxide surface than the higher viscosity, melted prepreg resin
normally would.  Secondly, the resin which forms around the brittle
copper oxide structure acts to support and reinforce the oxide
structure during the initial phase of the subsequent prepreg
lamination step, preventing damage to the ox...