Browse Prior Art Database

Common Burn-in Board/Socket Assembly for Range of Module Size

IP.com Disclosure Number: IPCOM000119025D
Original Publication Date: 1997-Oct-01
Included in the Prior Art Database: 2005-Apr-01
Document File: 6 page(s) / 274K

Publishing Venue

IBM

Related People

Grosch, D: AUTHOR [+3]

Abstract

NOTES: 1. 42.5 MM SUBSTRATE BOTTOM SURFACE WITH 1 MM SBC OR CCGA OR LGA PITCH 2. FOR ABOVE PATTERN SIGNAL I/O=S=882, POWER=X=441, GND=O=441 3. SMALLEST MODULE IN THE FAMILY 21 MM BY 21MM, LARGEST MODULE 42 MM BY 42 MM 4. FOR 21 X 21 MM SUBSTRATE, IN ABOVE PATTERN SIGNAL I/O=S=200, POWER=X=100, GN D=O=100 5. ASSIGN ALL SIGNAL I/Os TO BE CONTACTED AT BURN-IN WITH-IN 21 X 21 MM2 GRID F OR ALL SUBSTRATES

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 52% of the total text.

Common Burn-in Board/Socket Assembly for Range of Module Size

      NOTES:
  1.  42.5 MM SUBSTRATE BOTTOM SURFACE WITH 1 MM SBC OR CCGA OR
       LGA PITCH
  2.  FOR ABOVE PATTERN SIGNAL I/O=S=882, POWER=X=441, GND=O=441
  3.  SMALLEST MODULE IN THE FAMILY 21 MM BY 21MM, LARGEST MODULE
       42 MM BY 42 MM
  4.  FOR 21 X 21 MM SUBSTRATE, IN ABOVE PATTERN SIGNAL I/O=S=200,
       POWER=X=100, GN D=O=100
  5.  ASSIGN ALL SIGNAL I/Os TO BE CONTACTED AT BURN-IN WITH-IN
       21 X 21 MM2 GRID F OR ALL SUBSTRATES

      Disclosed is a method for reducing the design and build of
burn-in board for each module size.  Taking of advantage of
commonality across various package and chip designs, the invention
designs a common  burn-in board/socket assembly for a range of
modules sizes.

NOTES:
  1.  42.5 MM SUBSTRATE BOTTOM SURFACE WITH 1.27 MM SBC OR CCGA
       OR LGA PITCH
  2.  FOR ABOVE PATTERN SIGNAL I/O=S=512, POWER=X=256, GND=O=256
  3.  SMALLEST MODULE IN THE FAMILY 21 MM BY 21 MM, LARGEST MODULE
       42 MM BY 42 MM
  4.  FOR 21X21MM INNER PATTERN, SIGNAL I/O=S=128, POWER=X=64,
       GND=O=64
  5.  ASSIGN ALL SIGNAL I/Os TO BE CONTACTED AT BURN-IN WITH-IN
       21X21 MM2 GRID FOR ALL SUBSTRATE SIZES FROM 21 BY 21 MM2
       TO 42 BY 42 MM2

      Presently, IBM* designs and builds burn-in boards for each
module size, (x and y dimensions, and also module thickness).  This
adds design cost for each module x,y size and thickness.  This
current process  increases product development time and time to
market.  The existing process requires burn-in board inventory and
logistics for all different  sizes of modules.  Existing approach
does not give flexibility of using  burn-in boards in inventory to
accommodate changing module orders.

      In general, at burn-in, only few signal's Input/Outputs (I/Os)
out of...