Browse Prior Art Database

Multi-Component Vapor Isolation Scheme for Low Temperature Electronics

IP.com Disclosure Number: IPCOM000119071D
Original Publication Date: 1997-Nov-01
Included in the Prior Art Database: 2005-Apr-01
Document File: 4 page(s) / 98K

Publishing Venue

IBM

Related People

Chrysler, GM: AUTHOR [+3]

Abstract

Disclosed is a method and package which eliminates the moisture condensation on electronics modules operating at temperatures below the dew point.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 52% of the total text.

Multi-Component Vapor Isolation Scheme for Low Temperature Electronics

      Disclosed is a method and package which eliminates the moisture
condensation on electronics modules operating at temperatures below
the dew point.

      The required isolation is achieved by sealing the cold
electronics in a vapor tight, insulating package, as presented in
Fig. 1.  A single low temperature electronics module is positioned on
a board or card.  Both the front side of the board and the back side
are enclosed in thermal insulation.  The outer shell of the
insulation can be made from a moisture barrier.  The appropriately
thick insulation  maintains the outer surface of the insulation at a
temperature above the dew point eliminating any condensation on the
insulation.  The surface temperature of the board where it extends
beyond the insulation  is maintained above the dew point through
application of heaters at the  perimeter of the insulation.  In
addition, to prevent the ingress of moisture laden air, a gasket or
other seal may be placed between the board surface and the bottom
surface of the insulation jacket in contact  with the board surface.

      A second method of isolating the cold electronics from the
moisture in the air can be used if a vapor tight seal cannot be
assured.  Although not shown in Fig. 1, the general package is
basically the same as has been already described.  For this
embodiment, a small tank of pressurized dry nitrogen (or other gas)
is attached...