Browse Prior Art Database

Heat Sink with Electro Magnetic Compatibility Suppression

IP.com Disclosure Number: IPCOM000119184D
Original Publication Date: 1997-Dec-01
Included in the Prior Art Database: 2005-Apr-01
Document File: 2 page(s) / 43K

Publishing Venue

IBM

Related People

Kawakami, T: AUTHOR

Abstract

Disclosed is a heat sink with Electro Magnetic Compatibility (EMC) suppression. Fast and highly integrated chips generate a large amount of heat and high frequency electro magnetic noise. The heat generated by the chips must be removed efficiently because all failure mechanisms are accelerated by elevated temperatures. To prevent reliability and performance degradation, the temperature of semiconductor chips has to be maintained between 0 to 70 degrees/C. To meet the temperature range requirement, heat must be transferred away from the semiconductor devices rapidly, often by the use of heat sinks. Generally, the material in current heat sinks is aluminum or copper. However, these materials are not well suited for absorbing high frequency electro magnetic noise.

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Heat Sink with Electro Magnetic Compatibility Suppression

      Disclosed is a heat sink with Electro Magnetic Compatibility
(EMC) suppression.  Fast and highly integrated chips generate a large
amount of heat and high frequency electro magnetic noise.  The heat
generated by the chips must be removed efficiently because all
failure mechanisms are accelerated by elevated temperatures.  To
prevent reliability and performance degradation, the temperature of
semiconductor chips has to be maintained between 0 to 70 degrees/C.
To meet the temperature range requirement, heat must be transferred
away from the semiconductor devices rapidly, often by the use of heat
sinks.  Generally, the material in current heat sinks is aluminum or
copper.  However, these materials are not well suited for absorbing
high frequency electro magnetic noise.

      Fig. 1 shows an invention which simultaneously radiates heat
and absorbs high frequency electro magnetic noise.  This device can
be constructed in two ways: 1) Aluminum(a)/Ferrite(b) /Aluminum(c) or
2) Copper(a)/Ferrite(b)/Copper(c).

This heat sink has the following advantages:
  1.  By placing Ferrite between (a) and (c), shielding
       can be reduced or eliminated, and corresponding
       space savings can be realized.
  2.  By placing Ferrite between (a) and (c), radiation
       of heat and absorption of high-frequency electro
       magnetic noise can be done at the same time.
  3.  By placi...