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Electroless Cu Deposition on Oxide Powders

IP.com Disclosure Number: IPCOM000119202D
Original Publication Date: 1996-Mar-01
Included in the Prior Art Database: 2005-Apr-01
Document File: 2 page(s) / 42K

Publishing Venue

IBM

Related People

Giess, EA: AUTHOR [+2]

Abstract

Disclosed is a method for uniformly coating the surface of an oxide powder with Cu using electroless deposition.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 73% of the total text.

Electroless Cu Deposition on Oxide Powders

      Disclosed is a method for uniformly coating the surface of an
oxide powder with Cu using electroless deposition.

      Prior to carrying out electroless metal deposition, the surface
has to be made catalytically active to initiate the process.  This is
usually done by depositing a small amount of Pd and was carried out
as follows for the present powders.  Oxide powder was added to Pd
acetylacetonate dissolved in CH sub 3 CN (1 g Pd complex per 200 ml
solution) and the system stirred overnight at room temperature.
Following removal of the solvent and drying in a vacuum oven
overnight at 100 degrees C, the powder was heated in flowing forming
gas at 425 degrees C for 4 hours to reduce the palladium.  The Pd
loading was 1 wt  percent.

      The electroless bath composition was: 8 g/1 CuSo(4) .5H(2)O;
55 g/1 Na sub 2 EDTA .2H sub 2 O; 2 ml/1 37 percent HCHO; 11 ppm
NaCN; 10 ppm Gafac surfactant; pH = 11.7.  The bath was operated at
72 percent C.  The solution was agitated vigorously such that no
oxide powder resided on the bottom of the plating reactor during the
course of a run.  It was important to remove dissolved O sub 2 from
the bath during plating by N sub 2 purging.  Otherwise, plating was
very slow, or did not occur, due to facile O sub 2 transport to the
small oxide particles (usually 2-4 mum).

      Approximately 10 g of powder was plated per 4 liters of
solution in each run which typically to...