Browse Prior Art Database

NiFe Plating Process

IP.com Disclosure Number: IPCOM000119207D
Original Publication Date: 1996-Mar-01
Included in the Prior Art Database: 2005-Apr-01
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Christoffer, B: AUTHOR [+3]

Abstract

This article describes a NiFe plating process with suspended particles to form magnetic shields for MagnetoResistive (MR) devices.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 66% of the total text.

NiFe Plating Process

      This article describes a NiFe plating process with suspended
particles to form magnetic shields for MagnetoResistive (MR) devices.

      Magnetic recording with Magnetoresitive Heads (MR Heads)
requires magnetic shielding of the MR stripe during read cycle.  MR
heads of the first generation had plated permalloy for both magnetic
shields.

      Better tribological behavior and acceptable magnetic parameters
are known from a sputtered alloy called Sendust, which contains iron
(85%), aluminium (11%) and silicon (4%).  However, since Sendust was
implemented in the thin film production facilities it always created
huge problems:
  a) Sendust needs annealing at 450ºC to form its magnetic
      parameters,
  b) without vacuum annealing all wafers are totally oxidized and
      capping layers are necessary,
  c) Sendust deposition requires 5 to 6 hours deposition time and 16
      hours annealing,
  d) because of the high temperature other layers before Sendust
      deposition and even Sendust itself are very sensitive to
organic
      contamination.

      The combination of good magnetic and tribological parameters
can be achieved when a NiFe (80/20) layer is plated having very hard
particles suspended in the plating solurion.  These particles, like
e.g., aluminium oxide, silicon carbide, tungsten carbide or even
diamond powder can be customized for particle diameter and amount
"solved" in the plating...